A grinding-based manufacturing method for silicon wafers: An experimental investigation

International Journal of Machine Tools and Manufacture

Volumn 45, Issue 10, 2005, Pages 1140-1151

  Pei, Z J ^a   Fisher, Graham R ^b   Bhagavat, Milind ^b   Kassir, S ^c  

^a Sunflower Networking Group   (United States)

^b MEMC Electronic Materials Inc   (United States)

^c Strasbaugh Inc   (United States)

Author keywords

Grinding; Lapping; Machining; Manufacturing; Material removal; Semiconductor material; Silicon wafer

Indexed keywords

COST EFFECTIVENESS; ELECTRONICS INDUSTRY; LAPPING; LASER BEAMS; POLISHING; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR MATERIALS; SILICON WAFERS;

EDGE GRINDING; EDGE POLISHING; LASER MARKING; MATERIAL REMOVAL;

GRINDING (MACHINING);

EID: 17944370346     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2004.12.006     Document Type: Article

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