Fine grinding of silicon wafers: Designed experiments

International Journal of Machine Tools and Manufacture

Volumn 42, Issue 3, 2002, Pages 395-404

  Pei, Z J ^a   Strasbaugh, Alan ^b  

^a Sunflower Networking Group   (United States)

^b Strasbaugh Inc   (United States)

Author keywords

Ceramic machining; Grinding; Grinding force; Grinding marks; Material removal; Semiconductor materials; Silicon wafers; Surface roughness

Indexed keywords

COST EFFECTIVENESS; ROTATION; SILICON WAFERS; SURFACE ROUGHNESS;

FINE GRINDING;

GRINDING (MACHINING);

EID: 0036467803     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0890-6955(01)00123-7     Document Type: Article

References (7)

1. Plane silicon wafer technology
2. Fracture strength of large diameter silicon wafers
3. Abrasive machining of silicon
4. Fine grinding of silicon wafers