Fine grinding of silicon wafers: Effects of chuck shape on grinding marks

International Journal of Machine Tools and Manufacture

Volumn 45, Issue 6, 2005, Pages 673-686

  Sun, Wangping ^a   Pei, Z J ^a   Fisher, G R ^b  

^a Sunflower Networking Group   (United States)

^b MEMC Electronic Materials Inc   (United States)

Author keywords

Chuck shape; Grinding; Grinding mark; Machining; Modeling; Semiconductor material; Silicon wafer

Indexed keywords

CHUCKING MACHINES; GRINDING (COMMINUTION); LAPPING; MARKING MACHINES; MATHEMATICAL MODELS; MOTION ESTIMATION; SEMICONDUCTOR MATERIALS; SHRINKAGE;

CHUCK SHAPES; FINE GRINDING; GRINDING MARKS; MIRROR SURFACE;

SILICON WAFERS;

EID: 13444252448     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2004.09.020     Document Type: Article

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