Fine grinding of silicon wafers: Grinding marks

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn , Issue , 2002, Pages 311-320

  Pei, Z J ^a   Strasbaugh, Alan ^b  

^a KANSAS STATE UNIVERSITY   (United States)

^b Strasbaugh Inc   (United States)

Author keywords

Grinding; Grinding mark; Grinding wheels; Machining; Silicon wafers

Indexed keywords

ABRASIVES; GRINDING (COMMINUTION); GRINDING (MACHINING); GRINDING MACHINES; GRINDING MILLS; GRINDING WHEELS; MANUFACTURE; MECHANICAL ENGINEERING; MEMS; MICROELECTROMECHANICAL DEVICES; PATENTS AND INVENTIONS; SEMICONDUCTING SILICON; SEMICONDUCTING SILICON COMPOUNDS; VEHICLES;

BASE MATERIAL; DIRECT IMPACT; FINE GRINDING; GRINDING; GRINDING MARKS; GRINDING OPERATIONS; HIGH QUALITY; HIGH YIELD; LOW COSTS; MANUFACTURING PROCESS; PATENTED TECHNOLOGY; SEMI-CONDUCTOR WAFER;

SILICON WAFERS;

EID: 78249259724     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2002-33458     Document Type: Conference Paper

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