Waviness removal in grinding of wire-sawn silicon wafers: 3D finite element analysis with designed experiments

International Journal of Machine Tools and Manufacture

Volumn 44, Issue 1, 2004, Pages 11-19

  Sun, Xuekun ^a   Pei, Z J ^a   Xin, X J ^a   Fouts, Mandy ^b  

^a 129 Seaton Hall   (United States)

^b Bergman Elementary School   (United States)

Author keywords

Design of experiment; Finite element analysis; Grinding; Machining; Material removal; Semiconductor material; Silicon wafer; Slicing

Indexed keywords

ELASTIC MODULI; FINITE ELEMENT METHOD; POISSON RATIO; SILICON WAFERS;

MATERIAL REMOVAL;

GRINDING (MACHINING);

EID: 0142184975     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2003.09.001     Document Type: Article

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