Technological assessment of double side lapping of silicon

Abrasives

Volumn , Issue DEC./JAN., 2001, Pages 5-9

  Marinescu, I D ^a   Shoutak, A ^a   Spanu, C E ^a  

^a UNIVERSITY OF TOLEDO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; CRYSTALLINE MATERIALS; EMULSIONS; ETCHING; GRINDING (MACHINING); HIGH PRESSURE EFFECTS; LAPPING; SEMICONDUCTOR DEVICE MANUFACTURE; SINGLE CRYSTALS; SLURRIES; SURFACE ROUGHNESS;

DOUBLE SIDE LAPPING (DSL);

SILICON WAFERS;

EID: 0035673190     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

1. Chemical aspects of tool wear in single point diamond turning
2. Technical details of silicon machining behavior from a diamond toolmakers's perspective
3. Ductile regime turning mechanism of single crystal silicon