Finite element analysis on soft-pad grinding of wire-sawn silicon wafers

Journal of Electronic Packaging

Volumn 126, Issue 2, 2004, Pages 177-185

  Xin, X J ^a   Pei, Z J ^a   Liu, Wenjie ^a  

^a Sunflower Networking Group   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; GRINDING (MACHINING); MICROPROCESSOR CHIPS; SEMICONDUCTOR DEVICE MANUFACTURE; SURFACE PHENOMENA; VACUUM; WIRE;

MANUFACTURING PROCESSES; SOFT-PAD GRINDING; SURFACE GRINDING; WIRE-SAWN WAFERS;

SILICON WAFERS;

EID: 12344326821     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1649243     Document Type: Article

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