Full field and microregion deformation measurement of thin films using electronic speckle pattern interferometry and array microindentation marker method

Optics and Lasers in Engineering

Volumn 43, Issue 8, 2005, Pages 869-884

  Li, Xide ^a   Wei, Cheng ^a   Yang, Yan ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Deformation; Electronic speckle pattern interferometry; Mechanical properties; Microindentation marks; Tensile testing; Thin films

Indexed keywords

COMPOSITE MATERIALS; DATA PROCESSING; DEFORMATION; DELAMINATION; ELASTIC MODULI; FRACTURE; INTERFEROMETRY; SPECKLE; TENSILE TESTING;

ELECTRONIC SPECKLE PATTERN INTERFEROMETRY (ESPI); MICROINDENTATION MARKS; MICRONNEWTON; MICROREGION DEFORMATIONS;

THIN FILMS;

EID: 16344368851     PISSN: 01438166     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.optlaseng.2004.09.004     Document Type: Conference Paper

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