Characterization of copper layers grown by electrochemical mechanical deposition technique

Thin Solid Films

Volumn 478, Issue 1-2, 2005, Pages 345-351

  Wang, Tony ^a   Lindquist, Paul ^a   Erdemli, Serkan ^a   Basol, Erol C ^a   Zhang, Richard ^a   Uzoh, Cyprian E ^a   Basol, Bulent M ^a  

^a NuTool Inc   (United States)

Author keywords

Copper; Crystallization; Electrochemistry; Metallization

Indexed keywords

ANNEALING; CRYSTALLIZATION; DEPOSITION; ELECTRIC CONDUCTIVITY; ELECTROCHEMISTRY; GRAIN SIZE AND SHAPE; METALLIZING; THERMAL EFFECTS;

COPPER LAYERS; ELECTROCHEMICAL DEPOSITION (ECD); MECHANICAL DEPOSITION; SUBMICRONS;

COPPER;

EID: 14544268619     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.11.109     Document Type: Article

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