A grain size limitation inherent to electroplated copper films

Proceedings of the IEEE 2000 International Interconnect Technology Conference, IITC 2000

Volumn , Issue , 2000, Pages 31-33

  Brongersma, S H ^a   Richard, E ^a   Vervoort, I ^a   Maex, K ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; GRAIN GROWTH; GRAIN SIZE AND SHAPE;

AVRAMI EXPONENT; ELECTROPLATED COPPER; ELECTROPLATED COPPER FILM; ELECTROPLATING BATH; GRAIN SIZE; NUMERICAL CALCULATION; SECONDARY GRAIN GROWTH;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84962895528     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2000.854272     Document Type: Conference Paper

References (6)

1. J. M. E. Harper, C. Cabral, Jr., P. C. Andricacos, L. Gignac, I. C. Noyan, K. P. Rodbell, and C. K. Hu, J. Appl. Phys. 86, 2516 (1999).
2. T. Ritzdorf, L. Graham, S. Jin, C. Mu, and D. Fraser, "Proceedings of the International Interconnect Technology Conference", IEEE (1998) pp. 106.
3. I. J. M. M. Raaijmakers, Thesis 'Fundamental aspects of reactions in Titanium-Silicon thin films for integrated circuits', pg. 64-67, Technical University of Eindhoven, The Netherlands.
4. S. H. Brongersma, I. Vervoort, E. Richard, I. Varga, and K. Maex, Submitted to Appl. Phys. Lett.
5. S. H. Brongersma, E. Richard, I. Vervoort, H. Bender, W. Vandervorst, S. Lagrange, G. Beyer, and K. Maex, J. Appl. Phys. 86, 3642 (1999).
6. S. H. Brongersma, E. Richard, I. Vervoort, and K. Maex, in 'Fifth International Workshop on Stress Induced Phenomena in Metallization', edited by Oliver Kraft et al. pp. 249. ISBN 1-56396-904-1.