Electrochemical mechanical deposition (ECMD) technique for semiconductor interconnect applications

Microelectronic Engineering

Volumn 64, Issue 1-4, 2002, Pages 43-51

  Basol B M ^a   Uzoh, C E ^a   Talieh, H ^a   Young, D ^a   Lindquist, P ^a   Wang, T ^a   Cornejo, M ^a  

^a NuTool Inc   (United States)

Author keywords

Copper; Electrochemical mechanical deposition; Electroplating

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COPPER; ELECTROCHEMISTRY; FABRICATION; INTERCONNECTION NETWORKS; SUBSTRATES;

ELECTROCHEMICAL MECHANICAL DEPOSITION (ECMD);

ELECTROPLATING;

EID: 0036776395     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(02)00770-0     Document Type: Article

References (6)