Electrochemical planarization of interconnect metallization

IBM Journal of Research and Development

Volumn 49, Issue 1, 2005, Pages 37-48

  West, Alan C ^a   Deligianni, Hariklia ^b   Andricacos, Panayotis C ^b  

^a Columbia University ^*  (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROCHEMISTRY; ELECTROLYTIC POLISHING; ELECTROPLATING; MASS TRANSFER; METALLIZING; REACTION KINETICS;

CHEMICAL MECHANICAL PLANARIZATION; INTERCONNECT METALLIZATION;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 13844256567     PISSN: 00188646     EISSN: None     Source Type: Journal    
DOI: 10.1147/rd.491.0037     Document Type: Article

References (64)

1. A. C. West, S. Mayer, and J. Reid, Electrochem. & Solid State Lett. 4, C50 (2001).
2. T. P. Moffat, D. Wheeler, W. H. Huber, and D. Josell, Electrochem. & Solid-State Lett. 4, C26 (2001).
3. J. W. Dini, "Electrodeposition of Copper," in Modern Electroplating Fourth edition, M. Schlesinger and M. Paunovic, Eds., John Wiley & Sons, New York, 2000.
4. B. M. Basol, C. E. Uzoh, H. Talieh, D. Young, P. Lindquist, T. Wang, and M. Cornejo, Microelectron. Eng. 64, 43 (2002).
5. J. M. Steigerwald, S. P. Murarka, and R. J. Gutmann, Chemical Mechanical Planarization of Microelectronic Materials, Wiley, New York, 1997.
6. C. L. Borst, D. G. Thakurta, W. N. Gill, and R. J. Gutman, J. Electron. Packag. 124, 262 (2002).
7. X. Xiao, N. Hata, K. Yamada, and T. Kikkawa, Rev. Sci. Instrum. 74, 4539 (2003).
8. J. Huo, R. Solanki, and J. McAndrew, Surf. Eng. 19, 11 (2003).
9. R. Contolini, A. F. Bernhardt, and S. T. Mayer, J. Electrochem. Soc. 141, 2503 (1994).
10. S. Mayer, R. Contolini, and A. Bernhardt, U.S. Patent 5,095,550, 1992.
11. R. J. Contolini, S. T. Mayer, R. T. Graff, L. Tarte, and A. F. Bernhardt, Solid State Technol. 40, 155 (1997).
12. D. Padhi, J. Yahalom, S. Gandikota, and G. Dixit, J. Electrochem. Soc. 150, G10 (2003).
13. S.-H. Chang, J.-M. Shieh, B.-T. Dai, M.-S. Feng, Y.-H. Li, C. H Shih, H. M. Tsai, S. L. Shue, R. S. Liang, and Y.-L. Wang, Electrochem. & Solid-State Lett. 6, G72 (2003).
14. S.-H. Chang, J.-M. Shieh, C.-C. Huang, B.-T. Dai, and M.-S. Feng, Jpn. J. Appl. Phys. 41, 7332 (2002).
15. S.-H. Chang, J.-M. Shieh, C.-C. Huang, B.-T. Dai, and M.-S. Feng, J. Vac. Sci. Technol. B 20, 2149 (2002).
16. J. Huo, R. Solanki, and J. McAndrew, J. Appl. Electrochem. 34 305 (2004).
17. M. Datta, J. Electrochem. Soc. 142, 3801 (1995).
18. E. Rosset, M. Datta, and D. Landolt, Plating & Surf. Finish. 72 60 (1985).
19. D. Landolt, R. H. Muller, and C. W. Tobias, J. Electrochem. Soc. 118, 36 (1971).
20. M. Datta and D. Landolt, Electrochim. Acta 25, 1263 (1979).
21. R. Rosenberg, D. C. Edelstein, C.-K. Hu, and K. P. Rodbell, Ann. Rev. Mater. Sci. 30, 229 (2000).
22. M. E. Gross, C. Lingk, W. L. Brown, and R. Drese, Solid State Technol. 42, 47 (1999).
23. N. Ibl, in Advances in Electrochemistry and Electrochemical Engneering, P. Delahay and C. W. Tobias, Eds., John Wiley, New York, 1962, p. 49.
24. D. P. Barkey, R. H. Muller, and C. W. Tobias, J. Electrochem. Soc. 136, 2199 (1989).
25. R. Vidal and A. C. West, J. Electrochem. Soc. 142, 2682 (1995).
26. J. S. Newman, Electrochemical Systems, Second edition, Prentice-Hall, Inc., Englewood Cliffs, NJ, 1991, p. 388.
27. C. W. Tobias and R. Wijsman, J. Electrochem. Soc. 100, 459 (1953).
28. M. Matlosz, P.-H. Vallotton, A. C. West, and D. Landolt, J. Electrochem. Soc. 139, 752 (1992).
29. K. Takahashi, J. Electrochem. Soc. 147, 1414 (2000).
30. W. E. Corbin, Jr., M. Datta, T. E. Dinan, and F. W. Kern, U.S. Patent 5,865,984, 1999.
31. P. A. Jacquet, Nature 135, 1076 (1935).
32. T. P. Hoar and J. A. Mowat, Nature 165, 64 (1950).
33. W. J. McTegart, The Electrolytic and Chemical Polishing of Metals, Pergamon Press, London, 1956.
34. D. Landolt, Electrochim. Acta 32, 1 (1987).
35. D. Landolt, "Mass Transport Processes in High Rate Metal Dissolution and Deposition," Proceedings of the Symposium on High-Rate Metal Dissolution Processes, M. Datta, B. R. MacDougall, and J. M. Fenton, Eds., The Electrochemical Society, Pennington, NJ, 1995, pp. 1-15.
36. M. Datta, IBM J. Res. & Dev. 42, 655 (1998).
37. J. S. Newman, Electrochemical Systems, Second edition, Prentice-Hall, Inc., Englewood Cliffs, NJ, 1991, pp. 341-345.
38. G. Prentice, Electrochemical Engineering Principles, Prentice-Hall, Inc., Englewood Cliffs, NJ, 1991.
39. A. J. Bard and L. R. Faulkner, Electrochemical Methods. Fundamentals and Applications, Second edition, John Wiley & Sons, New York, 2001.
40. R. Vidal and A. C. West, J. Electrochem. Soc. 145, 4067 (1998).
41. R. Vidal and A. C West, Electrochim. Acta 41, 2417 (1996).
42. M. Novak, A. K. N. Reddy, and H. Wroblowa, J. Electrochem. Soc. 117, 733 (1970).
43. R.-D. Grimm, A. C. West, and D. Landolt, J. Electrochem. Soc. 139, 1622 (1992).
44. T. P. Hoar, D. C. Mears, and G. P. Rothwell, Corrosion Sci. 5 279 (1965).
45. M. Datta and D. Landolt, Electrochim. Acta 25, 1255 (1980).
46. H. C. Kuo and D. Landolt, Electrochim. Acta 20, 393 (1975).
47. J. S. Newman, Electrochemical Systems, Second edition, Prentice-Hall, Inc., Englewood Cliffs. NJ, 1991, pp. 397-425.
48. H.-H. Strehblow and J. Wenners, Electrochim. Acta 22, 421 (1977).
49. C. Clerc and D. Landolt, Electrochim. Acta 33, 859 (1988).
50. T. R. Beck, Electrochim. Acta 30, 725 (1985).
51. C. Clerc and R. Alkire, J. Electrochem. Soc. 138, 25 (1991 ).
52. R. M. A. Azzam and N. M. Bashara, Ellipsometry and Polarized Light Elsevier Science Publishers, Amsterdam. 1987.
53. A. C. West, R.-D. Grimm, D. Landolt, C. Deslouis, and B. Tribollet, J. Electroanalyt. Chem. 330, 693 (1992).
54. D.T. Chin and H. Chang, J. Appl. Electrochem. 19, 95 (1989 ).
55. R. Vidal and A. C. West, J. Electrochem. Soc. 142, 2689 (1995).
56. S. H. Glarum and J. H. Marshall, J. Electrochem. Soc. 132, 2872 (1985).
57. J. Edwards, J. Electrochem. Soc. 100, 189C (1953).
58. C. Wagner, J. Electrochem. Soc. 101, 225 (1954).
59. M. Matlosz and D. Landolt, J. Electrochem. Soc. 136, 919 (1989).
60. R. Chalupa, Y. Cao, and A. C. West, J. Appl. Electrochem. 32 135 (2002).
61. Y. H. Im, M. O. Bloomfield, S. Sen, and T. S. Cale, Electrochem. & Solid-State Lett. 6, C42 (2003).
62. J. D. Yang and A. C. West, AIChE J. 43, 811 (1997).
63. D. R. Baker, M. W. Verbrugge, and J. Newman, J. Electroanal. Chem. 313, 23 (1991).
64. A. C. West, J. Electrochem. Soc. 140, 403 (1993).