Electrochemical planarization of interconnect metallization

IBM Journal of Research and Development

Volumn 49, Issue 1, 2005, Pages 37-48

  West, Alan C ^a   Deligianni, Hariklia ^b   Andricacos, Panayotis C ^b  

^a Fu Foundation School of Engineering and Applied Science   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROCHEMISTRY; ELECTROLYTIC POLISHING; ELECTROPLATING; MASS TRANSFER; METALLIZING; REACTION KINETICS;

CHEMICAL MECHANICAL PLANARIZATION; INTERCONNECT METALLIZATION;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 13844256567     PISSN: 00188646     EISSN: None     Source Type: Journal    
DOI: 10.1147/rd.491.0037     Document Type: Article

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