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Volumn 19, Issue 1, 2003, Pages 11-16

Electrochemical polishing of copper for microelectronic applications

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC POLARIZATION; ATOMIC FORCE MICROSCOPY; COPPER; CURRENT DENSITY; DIELECTRIC MATERIALS; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTRONIC PROCESSING; ORGANIC ACIDS; PERMITTIVITY;

EID: 0037941600     PISSN: 02670844     EISSN: None     Source Type: Journal    
DOI: 10.1179/026708402225010047     Document Type: Article
Times cited : (15)

References (19)
  • 12
    • 0037896914 scopus 로고    scopus 로고
    • US Patent 5,567,330, 22 October
    • Datta et al.: US Patent 5,567,330, 22 October 1996.
    • (1996)
    • Datta1
  • 16
    • 42149083959 scopus 로고
    • New York, Marcel Dekker, Inc., International Union of Pure and Applied Chemistry
    • A. J. Bard, R. Parsons and J. Jordan: 'Standard potentials in aqueous solution', 41, 292; 1985, New York, Marcel Dekker, Inc., International Union of Pure and Applied Chemistry.
    • (1985) Standard Potentials in Aqueous Solution , vol.41 , pp. 292
    • Bard, A.J.1    Parsons, R.2    Jordan, J.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.