Study of anodic layers and their effects on electropolishing of bulk and electroplated films of copper

Journal of Applied Electrochemistry

Volumn 34, Issue 3, 2004, Pages 305-314

  Huo, J ^a   Solanki, R ^a   McAndrew, J ^b  

^a OREGON HEALTH AND SCIENCE UNIVERSITY   (United States)

^b Electronics R and D Group   (United States)

Author keywords

Copper electropolishing; Electrochemical impedance spectroscopy; Mass transport; Migration smoothing; Ohmic levelling

Indexed keywords

ANODES; COPPER OXIDES; DIELECTRIC FILMS; ELECTROLYTIC POLISHING; ELECTROPLATING; ETHYLENE; GLYCOLS; MASS TRANSFER; MICROELECTRONICS; PHOSPHORIC ACID; PLASTIC FILMS; SILICON WAFERS; SOLUTIONS; WATER;

COPPER ELECTROPOLISHING; OHMIC LEVELLING;

METALLIC FILMS;

EID: 1542471514     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JACH.0000015621.31360.14     Document Type: Article

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