The effect of Al3Ti capping layers on electromigration in single-crystal aluminum interconnects

Applied Physics Letters

Volumn 72, Issue 21, 1998, Pages 2677-2679

  Srikar, V T ^a   Thompson, C V ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041529781     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.121096     Document Type: Article

References (12)

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