Electromigration drift velocity in Al-alloy and Cu-alloy lines

Journal of the Electrochemical Society

Volumn 143, Issue 3, 1996, Pages 1001-1013

  Hu, C K ^a   Lee, K Y ^a   Lee, K L ^a   Cabral Jr , C ^a   Colgan, E G ^a   Stanis, C ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; COPPER ALLOYS; ELECTRIC RESISTANCE; MAGNESIUM; METALLIZING; STRUCTURE (COMPOSITION); THIN FILMS; TIN; TUNGSTEN; ZIRCONIUM;

BAMBOO GRAINED ALUMINUM STRUCTURE; ELECTROMIGRATION DRIFT VELOCITY; ELECTROMIGRATION INDUCED VACANCY WIND; TUNGSTEN STUDS; VOID GROWTH;

ELECTROMIGRATION;

EID: 0030108763     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1836572     Document Type: Article

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