Microstructure and electromigration in copper damascene lines

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1999, Pages 263-269

  Arnaud, Lucile ^a   Tartavel, G ^a   Berger, T ^a   Mariolle, D ^a   Gobil, Y ^a   Touet, I ^a  

^a CEA LETI   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; CHEMICAL VAPOR DEPOSITION; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; DIFFUSION; ELECTROMIGRATION; GRAIN SIZE AND SHAPE; INTERFACES (MATERIALS); SILICA;

BAMBOO LINES; DAMASCENE COPPER INTERCONNECTS; SELF SURFACE DIFFUSION;

COPPER;

EID: 0032655681     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (16)