Electromigration-induced Cu motion and precipitation in bamboo Al-Cu interconnects

Acta Materialia

Volumn 51, Issue 1, 2003, Pages 49-60

  Witt, C ^a,b   Volkert, cynthia ^a   Arzt, E ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

^b SEMATECH   (United States)

Author keywords

Aluminium alloys; Electromigration; Heterogonous phase transformations; Interface diffusion; Precipitation

Indexed keywords

COPPER; DIFFUSION; ELECTRIC CURRENTS; INTERFACES (MATERIALS); NUCLEATION; PHASE TRANSITIONS; PRECIPITATION (CHEMICAL); SCANNING ELECTRON MICROSCOPY;

INTERCONNECTS;

ELECTROMIGRATION;

EID: 0037425461     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(02)00424-X     Document Type: Article

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