Effects of precipitate distribution on electromigration in Al-Cu thin-film interconnects

Applied Physics Letters

Volumn 73, Issue 6, 1998, Pages 762-764

  Han, J H ^a   Shin, M C ^a   Kang, S H ^b,c   Morris Jr , J W ^b,c  

^a Korea Institute of Science and Technology   (South Korea)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^c Lawrence Berkeley National Laboratory   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000243685     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.121993     Document Type: Article

References (13)

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