New investigation of copper's role in enhancing Al-Cu interconnect electromigration resistance from an atomistic view

Acta Materialia

Volumn 47, Issue 11, 1999, Pages 3227-3231

  Liu, X Y ^a   Liu, C L ^a   Borucki, L J ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COMPOSITION EFFECTS; COMPUTER SIMULATION; COPPER; DIFFUSION IN SOLIDS; ELECTRIC CONTACTS; ELECTRIC RESISTANCE; GRAIN BOUNDARIES; SEGREGATION (METALLOGRAPHY);

ELECTROMIGRATION LIFETIME; INCUBATION DIFFUSION;

ALUMINUM ALLOYS;

EID: 0033327867     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(99)00186-X     Document Type: Article

References (20)

1. Hu, C. K., Rosenberg, R. and Tu, K. N., Proceeding of Stress-induced Phenomena in Metallization, 2nd International Workshop (1993). American Institute of Physics, New York, 1994, p. 195
2. Kawasaki, H. and Hu, C. K., Digest of Technical Papers, 1996 IEEE Symposium on VLSI Technology, Hawaii, June 1996. IEEE, New York, 1996, p. 192
3. Rosenberg R. J. Vac. Sci. Technol. 9:1970;263.
4. Morris J.W. Jr., Kim C.-U., Kang S.H. J. Minerals Metals Mater. Soc. (JOM). 48(5):1996;43.
5. Thesis S.K., Prybyla J.A. Mater. Res. Soc. Symp. Proc. 403:1996;651.
6. Knowlton B.D., Frank R.I., Thompson C.V. Mater. Res. Soc. Symp. Proc. 391:1995;361.
7. Liu X.-Y., Xu W., Foiles S.M., Adams J.B. Appl. Phys. Lett. 72:1998;1578.
8. Daw M.S., Baskes M.I. Phys. Rev. Lett. 50:1993;1285.
9. Kresse G., Furthmüller J. Phys. Rev. B. 41:1996;11169.
10. Ercolessi F., Adams J.B. Europhys. Lett. 26:1994;583.
11. Foiles S.M., Baskes M.I., Daw M.S. Phys. Rev. B. 33:1986;7983.
12. Vanderbilt D. Phys. Rev. B. 41:1992;7892.
13. Liu C.-L., Liu X.-Y., Borucki L.J. Appl. Phys. Lett. 74:1999;34.
14. Foiles, S. M., in Surface Segregation and Related Phenomena, ed. P. A. Dowben and A. Miller. CRC Press, Boca Raton, 1990, p. 79
15. Liu X.-Y., Adams J.B. Acta mater. 46:1998;3467.
16. Small M.B., Smith D.A., Garrat-Reed A.J. Scripta metall. mater. 30:1994;1531.
17. Su C.M., Bohn H.G., Robrock K.-H., Schilling W. J. appl. Phys. 70:1991;2086.
18. Kim C.-U., Morris J.W. Jr., Génin F.Y., Fluss M.J. Mater. Res. Soc. Symp. Proc. 428:1996;213.
19. Lee K.T., Szpunar J.A., Morawiec A., Knorr D.B., Rodbell K.P. Can. Metall. Q. 34:1995;287.
20. Liu, X.-Y., unpublished