Electromigration damage in mechanically deformed Al conductor lines: Dislocations as fast diffusion paths

Acta Materialia

Volumn 48, Issue 9, 2000, Pages 2199-2208

  Baker, S P ^a,b   Joo, Young Chang ^a,c   Knauss M P ^a,d   Arzt, E ^a  

^a UNIVERSITY OF STUTTGART   (Germany)

^b Cornell University   (United States)

^c Seoul National University   (South Korea)

^d ROBERT BOSCH GMBH   (Germany)

Author keywords

Aluminum; Diffusion; Dislocations; Electromigration; Thin films

Indexed keywords

EID: 0012169025     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(00)00024-0     Document Type: Article

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