In situ study of Al2Cu precipitate evolution during electromigration in submicron Al interconnects

Materials Research Society Symposium - Proceedings

Volumn 428, Issue , 1996, Pages 207-212

  Theiss, Silva K ^a   Prybyla, J A ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; FILM GROWTH; GRAIN BOUNDARIES; NUCLEATION; PRECIPITATION (CHEMICAL); SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTING FILMS; TRANSMISSION ELECTRON MICROSCOPY;

POLYGRANULAR REGION; SUBMICRON RUNNERS;

ELECTROMIGRATION;

EID: 0030413305     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)