Diffusion and electromigration of Cu in single crystal Al interconnects

Materials Research Society Symposium - Proceedings

Volumn 516, Issue , 1998, Pages 71-75

  Srikar, V T ^a   Thompson, C V ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRYSTAL LATTICES; CRYSTAL MICROSTRUCTURE; DIFFUSION IN SOLIDS; DISLOCATIONS (CRYSTALS); ELECTRIC FIELD EFFECTS; ELECTROMIGRATION; GRAIN BOUNDARIES; SEMICONDUCTING ALUMINUM COMPOUNDS; SINGLE CRYSTALS; THERMAL EFFECTS; TRANSPORT PROPERTIES;

ELECTRON PROBE MICROANALYSIS (EPMA);

SEMICONDUCTOR DEVICE TESTING;

EID: 0032309047     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-516-71     Document Type: Conference Paper

References (12)