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Volumn 612, Issue , 2000, Pages D181-D186
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Concentration and stress evolution during electromigration in passivated Al(0.25 at.% Cu) conductor lines
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Author keywords
[No Author keywords available]
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Indexed keywords
CURRENT DENSITY;
ELECTRIC LINES;
ELECTROMIGRATION;
ELECTRON TRANSPORT PROPERTIES;
FLUORESCENCE;
GRAIN BOUNDARIES;
PASSIVATION;
POLYCRYSTALLINE MATERIALS;
STRAIN MEASUREMENT;
STRESS ANALYSIS;
X RAY DIFFRACTION ANALYSIS;
X-RAY MICROBEAM DIFFRACTION;
ELECTRIC CONDUCTORS;
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EID: 0034431034
PISSN: 02729172
EISSN: None
Source Type: Journal
DOI: 10.1557/proc-612-d1.8.1 Document Type: Article |
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Times cited : (4)
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References (21)
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