Copper migration and precipitate dissolution in aluminum/copper lines during electromigration testing

Materials Research Society Symposium - Proceedings

Volumn 428, Issue , 1996, Pages 187-199

  Shaw, T M ^a   Hu, C K ^a   Lee, K Y ^a   Rosenberg, R ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COPPER; CRYSTAL MICROSTRUCTURE; DIFFUSION IN SOLIDS; GRAIN BOUNDARIES; GRAIN GROWTH; INTERFACES (MATERIALS); POLYCRYSTALLINE MATERIALS; PRECIPITATION (CHEMICAL); TRANSMISSION ELECTRON MICROSCOPY; TUNGSTEN;

ALUMINUM/COPPER LINES; TUNGSTEN CONTACTS;

ELECTROMIGRATION;

EID: 0030412942     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-428-187     Document Type: Conference Paper

References (11)