A new concept® for making fine line substrate for active component in polymer

Microelectronics Journal

Volumn 34, Issue 2, 2003, Pages 99-107

  Jalonen, Paavo ^a  

^a SATAKUNTA UNIVERSITY OF APPLIED SCIENCES   (Finland)

Author keywords

Adhesion; Build up; Electrical deposition; Electroforming; Epoxy resin; Patterning; Roughness; Via holes

Indexed keywords

ELECTRODEPOSITION; ELECTROFORMING; EPOXY RESINS; LITHOGRAPHY; PHOTOSENSITIVITY; SPIN COATING; SPUTTERING; SUBSTRATES; SURFACE ROUGHNESS;

PATTERNING;

PRINTED CIRCUIT BOARDS;

EID: 0037303358     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(02)00171-4     Document Type: Article

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