Chemical and mechanical adhesion mechanisms of sputter-deposited metal on epoxy dielectric for HDI PCBs

Printed Circuit Fabrication

Volumn 25, Issue 1, 2002, Pages 18-34

  Martin, L J ^a   Wong, C P ^a  

^a Motorala Adv Product Technol Ctr   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; CHROMIUM; DIELECTRIC DEVICES; PLASMA ETCHING; SPUTTER DEPOSITION; X RAY PHOTOELECTRON SPECTROSCOPY;

HIGH DENSITY INTERCONNECTS (HDI);

PRINTED CIRCUIT BOARDS;

EID: 0036138469     PISSN: 02748096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

1. Substrate requirements for effective integration of chip scale packages and multichip modules
2. Electrical design and simulation of high density printed circuit boards
3. Substrate requirements for effective integration of chip scale packages and multichip modules
4. Spectroscopic studies of the chemical properties of thin metal films on poly(ether imide)
5. Spectroscopic studies of the chemical properties of thin metal films on poly(ether imide)
6. Sputter reduction of oxides by ion bombardment during auger depth profile analysis
7. Depth profile analysis of thin oxide films by auger electron spectroscopy