Multilayer planarization of polymer dielectrics

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 1, 2001, Pages 41-53

  Chiniwalla, Punit ^a   Manepalli, Rahul ^b   Farnsworth, Kimberly ^c   Boatman, Mary ^a   Dusch, Brian ^a   Kohl, Paul ^a   Bidstrup Allen, Sue Ann ^a  

^a Georgia Institute of Technology   (United States)

^b INTEL CORPORATION   (United States)

^c DuPont Fluoroproducts   (United States)

Author keywords

BCB; DOP; Epoxy; Multilayering; Planarization; Polyimide; Polymer dielectrics; Solvent induced swelling

Indexed keywords

CROSSLINKING; DIELECTRIC FILMS; ELECTROPLATING; EPOXY RESINS; MICROELECTRONICS; MULTILAYERS; PHOTOLITHOGRAPHY; PHOTOSENSITIVITY; POLYIMIDES; SWELLING; THIN FILMS; ULTRAVIOLET RADIATION;

DEGREE OF PLANARIZATION; MULTIPLE COAT PLANARIZATION; SINGLE LAYER PLANARIZATION; SOLVENT INDUCED SWELLING; THIN-FILM INTERLEVEL DIELECTRICS;

ELECTRONICS PACKAGING;

EID: 0035248197     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.909624     Document Type: Article

References (12)

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6. Spin coating and planarization
7. Planarization enhancement of polyimides by dynamic curing and the effect of multiple coating