Two-layer high density printed circuit board and its reliability

Microelectronics Reliability

Volumn 39, Issue 9, 1999, Pages 1337-1341

  Zhang, S ^a   De Baets, J ^a   Van Calster, A ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; COPPER; DIELECTRIC MATERIALS; ELECTRIC INSULATION; PEELING; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUIT TESTING; RELIABILITY; SUBSTRATES; THERMAL CYCLING;

PHOTOVIA;

PRINTED CIRCUIT BOARDS;

EID: 0033354470     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(99)00048-7     Document Type: Article

References (7)

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3. Harazono M., Iwata Y., Takami S. A new built-up epoxy resin PCB technology for high density surface mount package and device attachment. Proceedings of the International Conference on Multichip Modules, ICEMCM'97, Denver, CO :1997;214-217.
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