Investigation of the correlation of peel strength and pad adhesion measurements using different printed circuit board base materials

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1998, Pages 58-65

  Mueller, S ^a  

^a Hewlett Packard GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; INDUSTRIAL ELECTRONICS; MANUFACTURE; PARAMETER ESTIMATION; STRENGTH OF MATERIALS; TIMING CIRCUITS;

ADHESION MEASUREMENT; ADHESION TEST; DEGREE OF CORRELATIONS; FRACTURE MODE; MEASUREMENT METHODS; PEEL STRENGTH; SAMPLE PREPARATION; TEST PARAMETERS;

PRINTED CIRCUIT BOARDS;

EID: 79958716033     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.1998.731025     Document Type: Conference Paper

References (0)