Achieving fine lines using UV laser photolithography

Printed Circuit Fabrication

Volumn 24, Issue 7, 2001, Pages 26-34

  Corbett, S ^a   Swenson, E ^a   Strole, J ^a   Beck, B ^a   Yarno, J ^a   Hughes, T ^a  

^a MicroSound Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; DIELECTRIC MATERIALS; DRILLING; HEAT AFFECTED ZONE; IMAGING TECHNIQUES; LASER ABLATION; MASKS; PHOTORESISTS; PLASMA ETCHING; Q SWITCHED LASERS; SUBSTRATES; ULTRAVIOLET RADIATION;

LASER DRILLING; ULTRAVIOLET (UV) LASER LITHOGRAPHY;

PHOTOLITHOGRAPHY;

EID: 0035399390     PISSN: 02748096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. New laser processing techniques for thick & thin-film circuit manufacturing
2. Advanced multilayer polyimide substrate utilizing UV laser microvia technology
3. Lasers Speed up Board Production
4. Direct write exposure and ablation of photo-resist in fine scale interconnect circuits
5. Laser micromachining in electronics manufacturing: A historical overview