New era of electronics packaging and its technical difficulties

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 1-4

  Tsukada, Yutaka ^a  

^a IBM JAPAN LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION; FLIP CHIP DEVICES; PRINTED CIRCUIT DESIGN; SURFACE MOUNT TECHNOLOGY;

ENCAPSULATED FLIP CHIP BONDING;

ELECTRONICS PACKAGING;

EID: 0033348192     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)

1. JPCA, 1998, "Front Line of Build-up PCB Technology", JPCA show'98
2. Kawakita, Y., Sakamoto, K., Nishiyama, T. and Saita M., 1998, "Thermal and Water Absorption Property of New Resin Multi-layer PCB-ALIVH", Proceedings of 12th JIEP conference, pp.47-48
3. Mitamura, K., 1998, "Wiring Design of New Resin Multi-layer PCB-ALIVH", Proceedings of 12th JIEP conference, pp.189-190
4. Sematech, 1997, "The national technology roadmap for semiconductors", http://notes.sematic.org/1997mem.htm
5. Tachibana, M., 1998, "Thermal and Water Absorption Property of New Resin Multi-layer PCB-ALIVH", Proceedings of 12th JIEP conference, pp.257-258
6. Takahashi, Y., 1998, "Build up PCB by AAP/10 method", Proceedings of MES'98 8th Microelectronics Symposium, pp153-156
7. Takeda, T., Satoh, Y., Tazawa, H., Takubo, T., Oguma, T., and Fukuoka, Y., 1998, "Development of B2it PCB for High Pin Count Package", Proceedings of 12th JIEP conference, pp.231-232
8. Yasu laboratory-IBM Japan, 1999, "Package Description", http://www.biwako.ne.jp/~slcyasu/slc/description.htm