New high-density multilayer technology on PCB

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 158-164

  Shimoto, T ^a   Matsui, K ^a   Shimada, Y ^a   Utsumi, K ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CHIP SCALE PACKAGES; EPOXY RESINS; FILM PREPARATION; GLASS TRANSITION; LAMINATES; LIGHT SENSITIVE MATERIALS; MULTILAYERS; NETWORK COMPONENTS; PHOTOSENSITIVITY; PRINTED CIRCUIT BOARDS; THERMAL EXPANSION; CONDUCTIVE MATERIALS; DIELECTRIC MATERIALS; ETCHING; PHOTOSENSITIVE GLASS; PLASTIC LAMINATES; PRINTED CIRCUIT MANUFACTURE; SPUTTERING; SUBSTRATES;

ARRAY INTERCONNECTION TECHNOLOGY; DIELECTRIC FABRICATION; EPOXY ACRYLATE RESINS; HIGH-DENSITY PACKAGING; HIGH-DENSITY SUBSTRATES; LOW CURING TEMPERATURE; MANUFACTURING FACILITY; PHOTOSENSITIVE MATERIALS;

SUBSTRATES; PRINTED CIRCUIT BOARDS;

DEPOSITED SUBSTRATE ON LAMINATE (DSOL) TECHNOLOGY;

EID: 0031633455     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678686     Document Type: Conference Paper

References (5)

1. T. Shimoto, K. Matsui, K. Utsumi, "Cu/Photosensitive-BCB Thin-Film Multilayer Technology for High-Performance Multichip Modules", IEEE Trans. Components, Packaging, Manufacturing Technology, Part B, vol. 18, No. l, ppl8-22, Feb. 1995.
2. K. Matsui, T. Shimoto, Y. Shimada, K. Utsumi, "MCM-D/L technology Based on Cu/Benzocyclobutene Thin Film Multilayer Structure", Proceedings of ISHM '95, pp 396-401, 1995.
3. R. R. Tummala, E. J. Rymaszewski, A. G. Klopfenstein, "Microelectronics Packaging Handbook", Part II, pp 658, 1996.
4. H. Ohta, T. Ohshima, M. Ikeda, S. Hotta, "Development of DVH-ADD Printed Wiring Board for High Density MCM", Proceedings of Printed Circuit World Convention VII, pp 21(l)-(4), 1996.
5. M. Jimarez, "Surface Laminar Circuit™ Carrier and Flip Chip Assembly Enabling Technologies for Advanced Computer Applications", Proceedings of the 6th International Conference and Exhibition on MCMs, pp 70-74, 1997.