The effect of sputtered interface metallic layers on reinforced core laminate making build-up structures

Microelectronics Reliability

Volumn 42, Issue 7, 2002, Pages 1075-1079

  Jalonen, Paavo ^a   Tuominen, Aulis ^a  

^a UNIVERSITY OF TURKU   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER DEPOSITS; ELECTROLESS PLATING; ELECTROLYSIS; PALLADIUM; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SPUTTERING;

REINFORCED CORE LAMINATES;

MICROELECTRONICS;

EID: 0036641732     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00059-8     Document Type: Article

References (8)

1. Plasma enhanced chemical vapor deposition for the production of high density interconnects
2. New high-density multilayer technology on PCB
3. The importance of solder resist adhesion in flip chip application