A review of epoxy materials and reinforcements, Part 1

Printed Circuit Fabrication

Volumn 25, Issue 4, 2002, Pages

  Ehrler, Sylvia ^a  

^a Multilayer Technol GmbH and Co KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CROSSLINKING; DYNAMIC MECHANICAL ANALYSIS; EPOXY RESINS; LAMINATES; WATER ABSORPTION;

COPPER ADHESION; EPOXY MATERIALS;

PRINTED CIRCUIT MANUFACTURE;

EID: 0036533719     PISSN: 02748096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. Base material basics: Manufacture and market
2. Reliability investigations of printed circuit boards