Reliability assessment of microvias in HDI printed circuit boards

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 2, 2002, Pages 254-259

  Liu, Fuhan ^b   Lu, Jicun ^a,b   Sundaram, Venky ^b   Sutter, Dean ^b   White, George ^b   Baldwin, Daniel F ^a,b   Tummala, Rao R ^a,b  

^a IEEE

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

High density interconnect; Microvia; Reliability; Substrate; Thermal shock test

Indexed keywords

DIELECTRIC MATERIALS; ELECTRONICS PACKAGING; FABRICATION; FLIP CHIP DEVICES; RELIABILITY THEORY; SHOCK TESTING; SUBSTRATES;

HIGH DENSITY INTERCONNECT (HDI) SUBSTRATES;

PRINTED CIRCUIT BOARDS;

EID: 0036613471     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.1010014     Document Type: Article

References (12)

1. SOP: The microelectronics for the 21st century with integral passive integration
2. Ultra fine line HDI technology at Georgia Tech PRC
3. Comparison of various microvia technology
4. An overview of microvia technology
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6. Microvias. The hole story, Part II. Three competing technologies: Which one for you?
7. Photovia technology: Some important aspects for reliability
8. A two-layer high density printed circuit board and its reliability
9. Cure kinetics modeling of ViaLux™ 81: A novel epoxy photo-dielectric dry film for microvia applications