Fabrication of ultra-fine line circuits on PWB substrates

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1425-1431

  Liu, Fuhan ^a   Sundaram, Venky ^a   Mekala, Sharath ^a   White, George ^a   Sutter, Dean A ^a   Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTERCONNECTION NETWORKS; MICROELECTRONIC PROCESSING; PERMITTIVITY; PERSONAL DIGITAL ASSISTANTS; SUBSTRATES;

HIGH DENSITY WIRING (HDW);

PRINTED CIRCUIT BOARDS;

EID: 0036292724     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Micro/chip scale packages and the semiconductor industry road map
2. SOP vs. SOC at Georgia tech PRC
3. The Package with fine line patterns and its microfabrication technology
4. An overview of microvia technology
5. Design and manufacturing factor of micro-via buildup substrate technologies
6. High density substrate for semiconductor packages using newly developed low CTE build-p materials
7. Advanced package and substrate technology