The applicability of electrodeposited photoresists in producing ultra-fine lines using sputtered seeding layers

Circuit World

Volumn 28, Issue 2, 2002, Pages 11-13

  Jalonen, Paavo ^a   Tuominen, Aulis ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

Photoresists; Printed circuits

Indexed keywords

COPPER; ELECTRODEPOSITION; ELECTROPHORESIS; GLASS FIBERS; PHOTORESISTS; PRINTED CIRCUIT BOARDS; SPIN COATING;

DRY FILM METHOD; ELECTROLESS COPPER; ELECTROPHORETIC DEPOSITION; EPOXY REINFORCED FIBERGLASS;

PRINTED CIRCUIT MANUFACTURE;

EID: 0035736322     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120210412805     Document Type: Article

References (6)

1. Build-up technology for MCM-LS and high density plastic substrates