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Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 41, Issue 5 A, 2002, Pages 2962-2968

Metalorganic chemical vapor deposition of copper using (hexafluoroacetylacetonate)Cu(I)(3,3-dimethyl-1-butene)with a liquid delivery system

(4) Choi, Kyeong Keun a Pyo, Sung G a Lee, Dok Won a Rhee, Shi Woo a,b

a Pohang University of Science and Technology (POSTECH) (South Korea)

b Hynix Semiconductor Inc (South Korea)

Author keywords

(hfac)Cu(I)(DMB); Copper; Metallization; Mi crohardness; MOCVD; Precursor; Texture

Indexed keywords

ACTIVATION ENERGY; CATHODES; MAGNETRONS; METALLIC FILMS; METALLORGANIC CHEMICAL VAPOR DEPOSITION; MICROHARDNESS; MOLECULAR STRUCTURE; MORPHOLOGY; NUCLEAR MAGNETIC RESONANCE; SILICON WAFERS; SPUTTER DEPOSITION; SURFACE REACTIONS; SURFACE ROUGHNESS; TEXTURES; THERMODYNAMIC STABILITY; X RAY DIFFRACTION ANALYSIS;

LIQUID DELIVERY SYSTEMS;

COPPER;

EID: 0036577288 PISSN: 00214922 EISSN: None Source Type: Journal
DOI: 10.1143/jjap.41.2962 Document Type: Article

Times cited : (12)

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