Manufacturability of chemical vapor deposition of copper

Journal of the Electrochemical Society

Volumn 144, Issue 8, 1997, Pages 2829-2833

  Nguyen, Tue ^a,b   Charneski, Lawrence J ^a   Hsu, Sheng Teng ^a  

^a Sharp Microelectronics Technology Inc Inc   (United States)

^b ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACETONE; ADHESION; CHEMICAL VAPOR DEPOSITION; COPPER; ELECTRIC CONDUCTIVITY OF SOLIDS; ENERGY GAP; THERMAL EFFECTS;

HEXAFLUOROACETYLACETONE;

METALLIC FILMS;

EID: 0031210998     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837902     Document Type: Article

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