Experimental and analytical study of seed layer resistance for copper damascene electroplating

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 17, Issue 6, 1999, Pages 2584-2595

  Broadbent, E K ^a   Mcinerney, E J ^b   Gochberg, L A ^b   Jackson, R L ^a  

^a Portland Technology Center   (United States)

^b NOVELLUS SYSTEMS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0033262699     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.591132     Document Type: Article

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