Gap-filling property of Cu film by chemical vapor deposition

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 17, Issue 5, 1999, Pages 2256-2261

  Kobayashi, Akiko ^a  

^a Auelva Corporation   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 22844456153     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.590902     Document Type: Article

References (2)

1. D. Edelstein et al., Tech. Dig. Int. Electron Devices Meet. 97, 773 (1997).
2. K. Ueno, K. Ohto, and K. Tsunenari, in Advanced Metallization for ULSI Applications in 1994 (Materials Research Society, Pittsburgh, PA, 1995), p. 95.