Effect of nitrogen and oxygen annealing on the morphology and hardness behavior of copper thin films

Materials Characterization

Volumn 45, Issue 3, 2000, Pages 187-194

  Tsang, Chi Fo ^a   Woo, Jasmine ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; ATOMIC FORCE MICROSCOPY; CHEMICAL VAPOR DEPOSITION; COPPER; MORPHOLOGY; NITROGEN; OXIDATION; OXYGEN; PLASTIC DEFORMATION; SURFACE ROUGHNESS;

COPPER THIN FILMS; MICRO-INDENTATION TECHNIQUES;

THIN FILMS;

EID: 0034262807     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1044-5803(00)00072-3     Document Type: Article

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