Novel post electroplating in-situ rapid annealing process for advanced copper interconnect application

Proceedings of the IEEE 2000 International Interconnect Technology Conference, IITC 2000

Volumn , Issue , 2000, Pages 194-196

  Chen, M ^a   Shin, Ho Seon ^a   Cheung, R ^a   Morad, R ^a   Dordi, Y ^a   Rengarajan, S ^a   Tsai, S ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER; RAPID THERMAL ANNEALING;

ANNEAL PROCESS; ANNEAL TEMPERATURES; APPLIED MATERIALS; COPPER INTERCONNECTS; PROCESS REPEATABILITY; RAPID ANNEALING; RELIABILITY TEST; SELF-ANNEALING;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84962798492     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2000.854323     Document Type: Conference Paper

References (6)

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6. C. Simpson, et al, Presented at the Electrochemical Society Meeting, Hawaii, Oct. 1999.