Electrical and structural investigations in reliability characterisation of modern passives and passive integrated components

Microelectronics Reliability

Volumn 42, Issue 4-5, 2002, Pages 709-719

  Dziedzic, Andrzej ^a  

^a WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC PROPERTIES; FAILURE ANALYSIS; MICROSTRUCTURE; RAW MATERIALS; RELIABILITY; STABILITY; SURFACE MOUNT TECHNOLOGY; THICK FILMS;

PASSIVE INTEGRATED COMPONENTS;

PASSIVE NETWORKS;

EID: 0036540880     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00044-6     Document Type: Article

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