Development of thin film resistors for use in multichip modules

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 490-495

  Coates, K L ^a   Chien, C P ^a   Hsiao, Y Y R ^a   Kovach, D J ^a   Tang, C H ^a   Tanielian, M H ^a  

^a BOEING COMPANY   (United States)

Author keywords

embeddedpassives; MCM D; resistor; tantalum nitride; thin film

Indexed keywords

DEPOSITION; ENVIRONMENTAL TESTING; MICROPROCESSOR CHIPS; MULTICHIP MODULES; RESISTORS; SUBSTRATES; TANTALUM COMPOUNDS; X RAY ANALYSIS;

ELECTRONICS TECHNOLOGY; EMBEDDEDPASSIVES; FABRICATION TECHNOLOGIES; IMPROVING PERFORMANCE; MATERIALS AND PROCESS; TANTALUM NITRIDES; THIN-FILM DEPOSITIONS; THIN-FILM PROCESSING;

THIN FILMS;

EID: 84920035860     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670829     Document Type: Conference Paper

References (4)

1. J. Cech et al, Polymer Eng. And Sci., 32, 1646 (1992).
2. W. D. Westwood, N. Waterhouse, and P. S. Wilcox, "Tantalum Thin Films", Academic Press, New York, 1975.
3. A. Katz, et al., "Tantalum Nitride Films as Resistors on Chemical Vapor Deposited Diamond Substrates", J. Appl. Phys. Vol. 73 (lo), pp. 5208-5212, May 15, 1993.
4. C.-M. Lin, E. A. Logan and D. Tuckerman, "Precision Embedded Thin Film Resistors for Multichip Modules (MCM-D)", Proceedings of the 1997 IEEE Multi-Chip Module Conference, Santa Cruz, California, February 4-5, pp. 44-49, 1997.