Low-complexity MCM-D technology with integrated passives for high frequency applications

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 285-290

  De Samber, M ^a   Pulsford, N ^a   Van Delden, M ^a   Milsom, R ^b  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b Cross Oak Lane ^*  (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; GOLD; MICROPROCESSOR CHIPS; MOUNTINGS; MULTICHIP MODULES; PHASE LOCKED LOOPS; RESISTORS; SEMICONDUCTOR DEVICES;

EUTECTIC BONDING; HIGH-FREQUENCY APPLICATIONS; INTEGRATED PASSIVES; INTEGRATED SUBSTRATE; PASSIVE INTEGRATION; PHASE LOCKED LOOP (PLL); SILICON-BASED TECHNOLOGY; THIN FILM RESISTORS;

SUBSTRATES;

EID: 33846268533     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670795     Document Type: Conference Paper

References (7)

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2. R.C. Frye, P.R. Smith, R.R. Kola, Y.L. Low, M.Y. Lau, K.L. Tai, "Silicon MCM-D with Integrated Passive Components for RF Wireless Applications", 34th ISHM-Nordic Conference, Oslo, pp. 138-142, 1997.
3. D.A. Am, J.P. Parkerson, L.W. Schaper, S.S. Ang, "A Low Cost Multichip Module Using Flex Substrate and Ball Grid Array", Proceedings of the 1996 International Conference on Multichip Modules, Denver, Colorado, April 17-19, pp. 28-32, 1996.
4. S.M.Sze, "Physics of Semiconductor Devices", John Wiley and Sons, second edition, New York, pp. 214, 1981.
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6. R. Milsom Philips Journal of Research, in press
7. See for example, P.Horwitz and W.Hi11, "The Art of Electronics", CUP, pp. 428, 1980.