Electrical characterization of thin film integral passive devices on polyimide-based packaging structures

International Journal of Microcircuits and Electronic Packaging

Volumn 21, Issue 4, 1998, Pages 306-315

  Morcan, G ^a,b   Ang, S S ^{a,b,c,d,e,f,g}   Lenihan, T G ^a,h,i,j   Schaper, L W ^a   Parkerson, J P ^a   Brown, W D ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

^b TEXAS INSTRUMENTS   (United States)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^d SOUTHERN METHODIST UNIVERSITY   (United States)

^e UNIVERSITY OF ARKANSAS   (United States)

^f High Density Electronics Center   (United States)

^g AMERICAN SOCIETY FOR ENGINEERING EDUCATION   (United States)

^h WHEELING JESUIT UNIVERSITY   (United States)

ⁱ DEPAUL UNIVERSITY   (United States)

^j IBM   (United States)

more..

Author keywords

[No Author keywords available]

Indexed keywords

CHROMIUM SILICIDE RESISTORS; SPIRAL COPPER INDUCTORS; TANTALUM OXIDE DIELECTRIC CAPACITORS; THIN FILM INTEGRAL PASSIVE DEVICES;

CAPACITANCE; CAPACITORS; ELECTRIC INDUCTORS; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; PASSIVE NETWORKS; POLYIMIDES; RESISTORS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE STRUCTURES;

THIN FILM DEVICES;

EID: 6644222465     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

1. G. Morcan, "Electrical Characterization of Tantalum Oxide Thin Film Embedded Capacitors", M.S.E.E Thesis, University of Arkansas, 1997.
2. J. Parkerson, T. Lenihan, L. Schaper, and G. Morcan, "Product Design using Integrated Passive Components", Second International Conference on Flex Circuits, September 1996.
3. T. Lenihan, L. Schaper, G. Morcan, K. Fairchild, and P. Parkerson, "Embedded Thin Film Resistors, Capacitors, and Inductors in Flexible Polyimide Films," International Journal of Microcircuits and Electronic Packaging, IJMEP, Vol. 20, No. 4, pp. 474-481, 1997.
4. "Characterization of Thin Film Tantalum Oxide Capacitors on Polyimide Substrates", G. Morcan, S. S. Ang, T. G. Lenihan, L. W. Schaper, and W. D. Brown, submitted to IEEE Transactions on Components, Packaging, and Manufacturing Technology, CPMT, December 1997.
5. T. G. Lenihan, "Embedded Passive Devices in Flexible Polyimide Films," Ph.D. Dissertation, University of Arkansas, 1996.
6. Hiroshi Yoshino, Tomohiko Ihara, Shosaku Yamanaka, and Takashi Igarashi, "Tantalum Oxide Thin-film Capacitor Suitable for Being Incorporated Into an Integrated Package", IEEE/CHMT '98 Japan IEMT Symposium, pg. 156, 1998.
7. K. Chen, M. Nielsen, S. Soss, E. Rymaszewski, T. Lu, and C. Wan, "Study of Tantalum Oxide Thin Film Capacitors on Metallized Polymer Sheets for Advanced Packaging Applications", IEEE Transactions on Components, Packaging, and Manufacturing Technology, CPMT, Vol. 20, pp. 117-122, May 1997.
8. Kobe Instrument Division, Hewlett-Packard Company, "HP 4291A RF Impedance/Material Analyzer Operating Manual Set", Hyogo, Japan.