Resistors Integrated into MCM-D Modules: Fabrication and Performance

Russian Microelectronics

Volumn 29, Issue 6, 2000, Pages 368-375

  Vorob'eva, A I ^a   Moskvichev, K V ^a  

^a BELARUSIAN STATE UNIVERSITY OF INFORMATICS AND RADIOELECTRONICS   (Belarus)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0009042673     PISSN: 10637397     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1026683801458     Document Type: Article

References (10)

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3. Besser, B. and Robinson, L.B.D., MSM-L Approach Provides Cost-Effective Multichip Modules, Solid State Technol., 1994, pp. 49-55.
4. Perfecto, E.D. and Prasad, K., Multilevel Thin Film Packaging Technology at IBM, Proc. ISHM'93 MCM Conf., Colarado, 1993, pp. 1-10.
5. Perfecto, E.D. and Prasad, K., Comparison of Planar and Non-Planar Multilevel Cu-Polyimide Interconnect, Proc. ISHM'93 MCM Conf., Colorado, 1993, pp. 18-27.
6. Tadanca, M. and Lana, R.G., A Low Cost Manufacturing Process for High Density Hybrid Components Based on Multilayer Polyimide/Ceramic Structures, IEEE Trans. Compon., Hybrids Manuf. Technol., 1993, vol. 16, no. 1, pp. 13-20.
7. Berry, K. and McKinney, J., MSM-D Process Development and Manufacturability, Proc. ISHM'93 MCM Conf., Colorado, 1993, pp. 164-171.
8. Maurince, D. and Sage, G., Future of Multichip Modules in Electronics, Proc. Technology and Management Conf., Dorking, 1992, pp. 673-678.
9. Labunov, V.A., Sokol, V.A., Parkun, V.M., and Vorobiova, A.I., US Patent 5 580 825, 1995.
10. Vorobiova, A.I. and Outkina, E.A., Study of Pillar Microstructure Formation with Anodic Oxides, Thin Solid Films, 1998, vol. 324, no. 11, pp. 1-10.