MEMS and Si micromachined circuits for high-frequency applications

IEEE Transactions on Microwave Theory and Techniques

Volumn 50, Issue 3, 2002, Pages 858-866

  Katehi, Linda P B ^a,b,c   Harvey, James F ^a,d   Brown, Elliott ^a,e  

^a IEEE   (United States)

^b UNIVERSITY OF MICHIGAN   (United States)

^c PURDUE UNIVERSITY   (United States)

^d U S ARMY RESEARCH OFFICE   (United States)

^e UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

High frequency circuits; On wafer packaging; RF MEMS; Si micromachining; Three dimensional integration

Indexed keywords

HIGH-FREQUENCY CIRCUITS;

ANTENNA ARRAYS; ELECTRIC SWITCHES; ELECTRONICS PACKAGING; MICROMACHINING; MICROWAVE CIRCUITS; SILICON;

MICROELECTROMECHANICAL DEVICES;

EID: 0036500073     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.989969     Document Type: Article

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